Wafer Fabrication
Labs
Photomasks & Substrates
Scrub Track
Coat & Bake Track
Mask Align & Expose
Develop Track
Metallize
Lift Off
Probe
Trim
Wafer Fabrication Lab (Fab) overview with employees: 2000 sq ft, class 100, controlled and monitored environment
View from the south end of the wafer fabrication lab.
Scrub, coat and develop wafer tracks with mini-environments for automatically processing wafers.Scrub, coat and develop wafer tracks with mini-environments for automatically processing wafers.
Lab monitoring system for temperature, humidity, pressure, and particles.
Typical photomask, anti-reflection chrome on quartz, line widths to .35 microns.
Typical substrates, Quartz (SiO2), Lithium Niobate (LiNbO3), and Lithium Tantalate (LiTaO3). Sizes to 4" round and 10" rectangular.
Wafer Scrub Track to automatically clean and HMDS vapor prime 3 & 4" wafers.
Close-up of Wafer Scrub Track to automatically clean and HMDS vapor prime 3 & 4" wafers.
Manually clean large rectangular substrate in preparation for photoresist application.
Wafer Coat & Bake Track to automatically spin coat photoresist and pre-exposure bake 3 & 4" wafers.
Close-up of Wafer Coat & Bake Track to automatically spin coat photoresist and pre-exposure bake 3 & 4" wafers.
Manually spin coat large rectangular substrate.
Manually mask align in preparation for contact expose, 3 & 4" wafers and rectangular substrates to 10" long.
Contact expose photoresist by xenon flash, 3 & 4" wafers.
Contact expose photoresist by xenon flash, large rectangular substrates to 10" long.
Wafer develop track to automatically develop photoresist pattern and bake 3 & 4" wafers.
Close-up of wafer develop track to automatically develop photoresist pattern and bake 3 & 4" wafers.
Manually develop large rectangular substrate to form photoresist pattern.
Vacuum metallize with a chrome flash and .1 to 1 micron aluminum film over the patterned photoresist.
Loading 3 & 4" wafers for metallization.
Loading large rectangular substrates for metallization.
Lifting off the photoresist and unwanted aluminum in a solvent bath.
Die visual inspection 100%.
Lifting off the photoresist and unwanted aluminum in a solvent bath for a large rectangular substrate.
RF wafer probing each visually good die, 100%, 2 automatic probers with VNAs.
Close-up RF wafer probing each visually good die, 100%, 2 automatic probers with VNAs.
Atomic Force Microscope for nanometer scale inspection.
RIE Plasma frequency trim of narrow-band quartz wafers, die, and components.
Close-up of RIE Plasma frequency trim of narrow-band quartz wafers, die, and components.
Thin film AI phase correct dispersive filter components using a laser cut shadow mask.